We first developed a virtual device structure to test how ALD thickness affects hole size uniformity and CD. We started our virtual experiment by using two crisscross SAQP processes and transferring a ...
Here we saw three examples of how engineers from the food and beverage industry use multiphysics modeling and simulation apps ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
As part of system development, many industries, including the automobile industry, make substantial use of modeling and simulation to help understand system performance. Modeling and simulation ...
A critical piece of equipment develops cracks. Vibration increases, and problems escalate until the system fails. Maintenance teams struggle to implement a permanent fix while the supplier offers no ...
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