Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
A new technical paper titled “Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs” was published by researchers at Electronics and Telecommunications Research Institute ...
A technical paper titled “SCAR: Scheduling Multi-Model AI Workloads on Heterogeneous Multi-Chiplet Module Accelerators” was published by researchers at University of California Irvine. “Emerging multi ...
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