ANDOVER, Mass., Sept. 30, 2024 (GLOBE NEWSWIRE) -- Vicor Corporation (NASDAQ: VICR) today announced that, on September 27, Administrative Law Judge Cameron Elliot of the U.S. International Trade ...

NUREMBERG, Germany--(BUSINESS WIRE)--Quectel Wireless Solutions, a global IoT solutions provider, is proud to introduce the SG882G, its latest flagship Android/Linux smart module, designed to deliver ...

NUREMBERG, Germany--(BUSINESS WIRE)--Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of the SH603ZA-AP smart module, designed to support a wide range ...

The Raspberry Pi Compute Module 5 (CM5) takes modular computing to a new level, offering enhanced performance, expanded connectivity, and upgraded hardware. Designed with developers, hobbyists, and ...

Artificial intelligence is reshaping the global technology landscape, and nowhere is this transformation more visible than in ...

Texas Instruments Inc. (TI) announced several power management devices and a reference design to help companies meet AI computing demands and scale power management architectures from 12 V to 48 V to ...

Power management has received increasing focus in microelectronic systems as the need for greater power density, efficiency and precision have grown apace. One of the important ongoing trends in ...

The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit. Have embedded developers ever had such a ...

Raspberry Pi's line of single-board computers are popular for myriad reasons, including the low cost, community support, and generous I/O port options. The newest Raspberry Pi skips the last one, but ...

Congatec has introduced a new line of COM Express Compact computer-on-modules (COMs) with AMD Ryzen Embedded 8000 Series processors, featuring up to eight ‘Zen 4’ cores, an XDNA NPU and Radeon RDNA 3 ...

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog ...

JEDEC has previewed the technical roadmap for the LPDDR6 memory standard, which will double individual module capacities to 512 GB using efficient SOCAMM2 form factors to support expanding Agentic AI ...